ACM Research (Shanghai) Inc.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 18344
 
  
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 850
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 645
 
  
 
B01F MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING 240
 
  
 
B06B GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL 222
 
  
 
C11D DETERGENT COMPOSITIONS 263
 
  
 
C25F PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR 216
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
B23B TURNING; BORING 151
 
  
 
B24C ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL117

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0033,654 A FALL-PROOF APPARATUS FOR CLEANING SEMICONDUCTOR DEVICES AND A CHAMBER WITH THE APPARATUSSep 08, 15Feb 01, 18[H01L, G08B, B08B]
2018/0025,940 METHOD FOR REMOVING BARRIER LAYER FOR MINIMIZING SIDEWALL RECESSFeb 15, 15Jan 25, 18[H01L]
2017/0327,965 METHODS AND APPARATUS FOR UNIFORMLY METALLIZATION ON SUBSTRATESMay 03, 17Nov 16, 17[C25D, H01L]
2017/0260,641 APPARATUS AND METHOD FOR UNIFORM METALLIZATION ON SUBSTRATENov 25, 14Sep 14, 17[C25D]
2017/0248,848 COATER WITH AUTOMATIC CLEANING FUNCTION AND COATER AUTOMATIC CLEANING METHODSep 16, 14Aug 31, 17[G03F]
2017/0216,800 FUNCTIONAL WATER PRODUCING APPARATUS AND FUNCTIONAL WATER PRODUCING METHODJan 27, 17Aug 03, 17[B01F, C11D]
2015/0155,183 METHOD AND APPARATUS FOR PULSE ELECTROCHEMICAL POLISHINGMay 24, 12Jun 04, 15[H01L, C25F]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9865476 Method and apparatus for pulse electrochemical polishingMay 24, 12Jan 09, 18[H01L, C25F]
9724803 Nozzle for stress-free polishing metal layers on semiconductor wafersMar 30, 12Aug 08, 17[B24C, C25F]
9666426 Methods and apparatus for uniformly metallization on substratesJun 24, 11May 30, 17[C25D, H01L]
9633833 Methods and apparatus for cleaning semiconductor wafersSep 30, 16Apr 25, 17[H01L, B08B]
9595457 Methods and apparatus for cleaning semiconductor wafersDec 12, 08Mar 14, 17[H01L, B08B]
9558985 Vacuum chuckMar 28, 12Jan 31, 17[B23B, H01L, B25B]
9492852 Methods and apparatus for cleaning semiconductor wafersMar 31, 09Nov 15, 16[H01L, B08B]
9496172 Method for forming interconnection structuresNov 27, 12Nov 15, 16[H01L]
9295167 Method to prewet wafer surfaceNov 12, 13Mar 22, 16[C23C, C25D, H01L, B05D, H05K]
9070723 Methods and apparatus for cleaning semiconductor wafersJul 05, 07Jun 30, 15[H01L, B08B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2011/0073,469 ELECTROCHEMICAL DEPOSITION SYSTEMAbandonedMar 19, 08Mar 31, 11[C25D]
2009/0107,846 Method and apparatus to prewet wafer surface for metallization from electrolyte solutionsAbandonedDec 27, 07Apr 30, 09[C23C, C25D, H01L]

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